Method of manufacturing heat sink for memory module

ABSTRACT

A method of manufacturing a heat sink for a memory module is provided to remarkably improve its productivity by treating a plurality of heat sinks, which are arranged at a pre-determined interval, as a single body in detaching, painting and adhesive pad adhering steps to reduce a manufacturing cost, and improve its merchantability by interrupting direct contact between the heat sinks to prevent scratch of the heat sinks. The method of manufacturing a heat sink for a memory module comprises cutting and detaching the heat sink from a metal plate coil by using a press device. The heat sinks are connected to a heat sink molded sheet at a pre-determined interval through a bridge, and are detached from the heat sink molded sheet by the press device. After the cutting and detaching steps, the heat sink molded sheet ( 10 ) is painted, an adhesive pad ( 5 ) is adhered to the painted heat sink molded sheet ( 10 ), and the heat sink is separated by cutting the bridge ( 12 ).

TECHNICAL FIELD

The present invention relates to manufacture of a heat sink for a memorymodule, and more particularly to a method of manufacturing a heat sinkfor a memory module which can remarkably improve its productivity bytreating a plurality of heat sinks, which are arranged at apredetermined interval, as a single body in detaching, painting andadhesive pad adhering steps to reduce a manufacturing cost, and canimprove its merchantability by interrupting direct contact between theheat sinks to prevent scratch of the heat sinks.

BACKGROUND ART

In general, a semiconductor memory module consists of semiconductorchips mounted on a printed circuit board having a plurality of pinswhich are electrically connected to a main board.

As the semiconductor device is downsized, high-integrated, andlightened, DDR (Double Data Rate) modules which transmit data at fastspeed have been commonly used long ago. A recently developed memorymodule can be operated at data transmission rate several times as fasteras that of the DDR module.

Since the speedup of the memory module is boosted up and a board of thememory module becomes light and thin, it is required to effectivelyradiate the heat generated from the board and to increase theproductivity thereof through mass production.

A heat sink for a memory module includes, as shown in FIGS. 1 and 2,heat sinks 11 adhered on both sides of a memory module 2 by an adhesivepad 5 having high thermal conductivity, and a clip 3 fixing the bothheat sinks 11.

Explaining the process of manufacturing the heat sink 11 according tothe prior art, a metal plate is cut one by one by using a press moldingdevice having shape corresponding to the heat sink. After the cut metalplates are painted, the painted metal plates are adhered to the memorymodule.

According to the conventional process, since the heat sinks 11 are cutand painted as a single body, the productivity is too low. In addition,since a body of the heat sink is directly pulled in the painting oradhering step, there is a problem in that scratch is produced on thesurface of the heat sink, thereby lowering the merchantability.

Also, since adhering the adhesive pad and assembling other componentsare conducted for each piece, the assembling productivity is lowered toincrease a manufacturing cost.

DISCLOSURE OF INVENTION Technical Problem

Therefore, the present invention has been made to solve theabove-mentioned problems occurring in the prior art, and an object ofthe present invention is to provide a method of manufacturing a heatsink for a memory module which can remarkably improve its productivityby treating a plurality of heat sinks, which are arranged at apredetermined interval, as single body in detaching, painting andadhesive pad adhering steps to reduce a manufacturing cost.

Another object of the present invention is to provide a method ofmanufacturing a heat sink for a memory module which can improve itsmerchantability by interrupting direct contact between heat sinks whentransferring the heat sinks to prevent scratch of the heat sinks.

Technical Solution

In order to accomplish the above-mentioned objects, there is provided amethod of manufacturing a heat sink for a memory module, the methodcomprising cutting and detaching the heat sink from a metal plate coilby using a press device, in which the heat sinks are connected to a heatsink molded sheet at a predetermined interval through a bridge, and aredetached from the heat sink molded sheet by the press device.

In one embodiment of the present invention, the method further comprisespainting the heat sink molded sheet after the cutting and detachingsteps; adhering an adhesive pad to the painted heat sink molded sheet;and separating the heat sink by cutting the bridge.

Advantageous Effects

According to the present invention, the method of manufacturing the heatsink for the memory module can remarkably improve the productivity bytreating a plurality of the heat sinks, which are arranged at apredetermined interval, as single body in detaching, painting andadhesive pad adhering steps.

Also, the heat sink are not directly contacted when transferring,thereby preventing scratch from being produced on the heat sink, therebyimproving the merchantability.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is an exploded perspective view illustrating a mounting of heatsinks to a memory module;

FIG. 2 is a perspective illustrating the heat sinks in FIG. 1;

FIG. 3 is a perspective view illustrating a heat sink molded sheetaccording to the present invention; and

FIG. 4 is a flowchart explaining the process of manufacturing a heatsink according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Now, a method of manufacturing a heat sink for a memory module accordingto a preferred embodiment of the present invention will be described indetail with reference to the accompanying drawings. In the followingdescription of the present invention, the same drawing referencenumerals are used for the same elements even in different drawings, andthe duplicate explanation thereof will be omitted.

FIG. 3 is a perspective view illustrating a heat sink molded sheetaccording to the present invention, and FIG. 4 is a flowchart explainingthe process of manufacturing the heat sink.

Referring to FIGS. 3 and 4, the method of manufacturing the heat sinkfor the memory module according to the present invention comprisescutting and detaching the heat sink from a metal plate coil by using apress device, in which the heat sinks 11 are connected to a heat sinkmolded sheet 10 at a predetermined interval through a bridge 12, and aredetached from the heat sink molded sheet 10 by the press device.

In this embodiment of the present invention, after the cutting anddetaching steps, the heat sink molded sheet 10 is painted, an adhesivepad 5 is adhered on the painted heat sink molded sheet 10, and then, thebridge 12 is cut.

The bridge 12 of the heat sink molded sheet 10 consists of first bridges12 a connected to left and right ends of the heat sink 11, and secondbridges 12 b connected to the first bridges 12 a to maintain anarranging interval of the heat sinks 11.

In the cutting and detaching steps, a cut line 12 c is formed on eachfront end of the first bridges 12 a, and through-holes 12 d are formedon the second bridge 12 b at a pre-determined pitch.

The through-holes 12 d serve as reference points when the heat sinkmolded sheet is transferred in the cutting and detaching steps, and isreceived with jig pins which fix the heat sink molded sheet whenadhering the adhesive pad or assembling other components.

The method of manufacturing the heat sink for the memory moduleaccording to the present invention will now be explained.

In the cutting and detaching steps, first of all, a space 15 between theheat sinks 11 is punched out from the metal plate coil, and desiredportions of both ends of the heat sinks 11 are bent to form ear-ringportions 1 a which guides the heat sink 11 when the heat sink isassembled to the memory module.

In this instance, the metal plate coil of a determined length isperiodically supplied to the press device, and the press device punchesthe spaces 15 in one unit or plural units by using a die cut. If theheat sinks of set units, for example, 10 or 15, are arranged, the secondbridge 12 b is cut so that the heat sink molded sheet 10 is made.

Next, after the heat sink molded sheet is painted in the painting step,the adhesive pad is adhered on the painted heat sink molded sheet. Atthat time, other components for the heat sink are assembled to the heatsink molded sheet.

More specifically, a plurality of heat sinks arranged in parallel at aregular interval are handled as a single body in the detaching,painting, and adhesive pad adhering steps, thereby remarkably increasingits productivity. Also, the second bridge 12 b is held when the heatsink is transferred. Therefore, the heat sink is not directly contacted,thereby preventing scratch form being formed on the heat sink.

Each of the complete heat sinks 11 connected in parallel to each otheris supported by the bridge 12.

In a separating step, the manufacturing process is completed by cuttingthe first bridge 12 a from the heat sinks 11.

In this instance, if the cut lines 12 c are formed on a connectionportion between the first bridge 12 a and the heat sink, the firstbridge 12 a can be easily cut from the heat sinks.

The forgoing embodiments are merely exemplary and are not to beconstrued as limiting the present invention. The present teachings canbe readily applied to other types of apparatuses. The description of thepresent invention is intended to be illustrative, and not to limit thescope of the claims. Many alternatives, modifications, and variationswill be apparent to those skilled in the art.

INDUSTRIAL APPLICABILITY

As apparent from the above description, the method of manufacturing theheat sink for the memory module can remarkably improve the productivityby treating a plurality of the heat sinks, which are arranged at apredetermined interval, as single body in detaching, painting andadhesive pad adhering steps.

Also, the heat sink are not directly contacted when transferring,thereby preventing scratch from being produced on the heat sink, therebyimproving the merchantability.

1. A method of manufacturing a heat sink for a memory module, the methodcomprising cutting and detaching the heat sink from a metal plate coilby using a press device, in which the heat sinks 11 are connected to aheat sink molded sheet 10 at a pre-determined interval through a bridge12, and are detached from the heat sink molded sheet 10 by the pressdevice.
 2. The method as claimed in claim 1, further comprising paintingthe heat sink molded sheet 10 after the cutting and detaching steps;adhering an adhesive pad 5 to the painted heat sink molded sheet 10; andseparating the heat sink by cutting the bridge
 12. 3. The method asclaimed in claim 1, wherein the bridge 12 of the heat sink molded sheet10 consists of first bridges 12 a connected to left and right ends ofthe heat sink 11, and second bridges 12 b connected to the first bridges12 a to maintain an arranging interval of the heat sinks
 11. 4. Themethod as claimed in claim 1, wherein in the cutting and detachingsteps, a cut line 12 c is formed on each front end of the first bridges12 a, and through-holes 12 d are formed on the second bridge 12 b at apredetermined pitch.